I wanted to bring people through my attempt stage by stage of making up a DIY 1.5 board. I am concerned with some of the blistering on the under side of the board which runs along the right hand edge of the ITE chip. I had many frustrating bridges, and this edge was my first ever attempt and I applied far too much solder paste. Lesson learnt and the other sides are much much cleaner. Pretty confident no bridges remain.
Can you guys critique it? I know the pictures are not nearly zoomed in enough to know how good the job really is but I would like to know if you think this blistering is going to cause me an issue.
Also – quick question, the other main chips have an area in the center of the chip on the under side, and the board has a copper square pad too. What is this for? How much of that needs to be soldered in place, and how exactly do you do it? Hot air for 10 seconds directly on top of the chip? Scary stuff!